Adhesive constant temperature control method

专利摘要:
The present invention provides an adhesive coating method for applying an adhesive to a surface of an arbitrary adhesive object through a coating syringe having a fine nozzle; By keeping the internal and external temperatures of the application syringe constant, the adhesive is incubated even after being applied to the adhesive object. Thereby, the viscosity of an adhesive agent is kept constant and an appropriate amount of adhesive agent can be apply | coated uniformly, and adhesive force improves.
公开号:KR19990032752A
申请号:KR1019970053886
申请日:1997-10-21
公开日:1999-05-15
发明作者:김우식；김철수；마사하루 스꾸에；우병우
申请人:윤종용；삼성전자 주식회사；
IPC主号:

专利说明:

Adhesive constant temperature control method
The present invention relates to an adhesive constant temperature management method, and more particularly to a method for maintaining a constant temperature of the adhesive so that the viscosity of the adhesive is kept constant.
In general, adhesives are adhesion media materials used to bond any adhesive object with another adhesive object, and are generally mucus, ie sticky liquid. Therefore, the application method using the application | coating syringe which has a fine nozzle is also mainly used for apply | coating this to the surface of an adhesion object.
In the application method as described above, the viscosity of the adhesive is one of the important environmental variables that determine the application state and the coating amount of the adhesive together with the injection pressure. In addition, in view of the fact that the application state and the application amount of the adhesive affect its adhesion, it is necessary to keep the viscosity of the adhesive constant in order to obtain the best adhesion. On the other hand, since the viscosity of the adhesive changes depending on its temperature, in order to obtain the best adhesive strength, it will be necessary to keep the temperature of the adhesive constant.
To this end, conventionally, the adhesive was placed in a thermostat maintained at an appropriate temperature and then constant temperature controlled by using. However, the adhesive heated to the proper temperature not only loses heat from the syringe for application at room temperature (about 21 ° C) but also loses heat to air at room temperature after being applied to the surface of the object to be bonded. Could not be maintained. In other words, the conventional method is insufficient for constant temperature control of the adhesive.
Therefore, an object of the present invention is to provide an adhesive constant temperature control method for constant temperature control of the adhesive so that the viscosity of the adhesive can be maintained even after being applied to the adhesive object.
1 is a view for explaining a method for applying an adhesive to a printed circuit board under constant temperature management in accordance with the present invention.
<Explanation of symbols for the main parts of the drawings>
10: printed circuit board 20: application syringe
20a: syringe body 20b: nozzle
21: heater 21a: heating coil
30: adhesive
The present invention for achieving the above object, in the adhesive coating method for applying an adhesive to the surface of any adhesive object through a coating syringe having a fine nozzle; It is characterized in that the internal temperature and external temperature of the application syringe is kept constant within the same range.
Here, it is preferable to set the range of the internal temperature and the external temperature of the application | coating syringe to 26 degreeC-28 degreeC.
When the internal temperature and the external temperature of the application syringe are kept constant in this manner, the viscosity of the adhesive can be kept constant and an appropriate amount of the adhesive can be uniformly applied, thereby improving the adhesive force.
Hereinafter, a preferred embodiment of the present invention will be described in detail.
Here, a case where an adhesive is applied to a printed circuit board to attach a semiconductor chip will be described as an example.
Referring to FIG. 1, the application syringe 20 includes an adhesive housed inside the syringe body 20a while the nozzle 20b moves at a predetermined speed while maintaining the separation height from the surface of the printed circuit board 10. 30 is sprayed through the nozzle 20b. At this time, the application syringe 20 moves in a zigzag form and uniformly applies the adhesive 30 to the predetermined region A to which the semiconductor chip is attached.
Here, the adhesive 30 is constant temperature managed so that the viscosity can be properly maintained, since the internal temperature and the external temperature of the application syringe 20 are kept constant.
Here, the internal temperature of the application syringe 20 is kept constant at a predetermined temperature by the heating coil 21a of the heater 21 surrounding the syringe body 20a. And the external temperature, that is, the environmental temperature of the application syringe 20 is also maintained at a predetermined temperature through the room temperature control.
At this time, both the internal temperature and the external temperature of the application syringe 20 are appropriately set to 26 ° C to 28 ° C, and this temperature range is based on the experimental results shown in Table 1 below.
24 ℃26 ℃28 ℃30 ℃ 1 time0.1477 g0.1473 g0.1484 g0.1525 g Episode 20.1576 g0.1600 g0.1632 g0.1685 g 3rd time0.1596 g0.1620 g0.1637 g0.1674 g 4 times0.1683 g0.1716 g0.1705 g0.1727 g Average0.1583 g0.1602 g0.1615 g0.1653 g
Table 1 shows the results of experiments on the change in the coating amount of the adhesive 30 according to the temperature change of 24 ° C to 30 ° C, which shows that the application syringe 20 having the nozzle 20b having an inner diameter of 0.33 mm is 10. It is the result when apply | coating the adhesive agent 30 at the injection pressure of 4 kg.f / cm <2>, moving at the speed of mm / sec.
Referring to Table 1, the application amount of the adhesive 30 is changed by an average amount of 0.01g with respect to the temperature change of 24 ℃ to 30 ℃, which is not negligible considering that the semiconductor chip to be bonded to this small It can be seen. Among them, when the adhesive 30 was applied at a temperature of 26 ° C. to 28 ° C., uniform coating was possible and showed the best adhesion. And the application amount thereof was also appropriate. Thus it was set as a temperature range for constant temperature management.
That is, the adhesive 30 is heated and maintained at a temperature of 26 ° C. to 28 ° C. in the application syringe 20, and is sprayed through the nozzle 20b to the outside of the application syringe 20 to print the printed circuit board ( Even after being applied to 10) it is kept constant by the room temperature set to a temperature of 26 ℃ to 28 ℃.
As such, the adhesive 30 which is controlled at a constant temperature is kept at a constant viscosity so that an appropriate amount is uniformly applied to the printed circuit board 10, thereby improving adhesive strength.
As described above, the present invention maintains the internal temperature and the external temperature of the coating syringe uniformly, so that the adhesive is incubated even after being applied to the object to be bonded, whereby the viscosity of the adhesive is kept constant and the appropriate amount of adhesive It can apply | coat uniformly, and there exists an effect which adhesive force improves.

权利要求:
Claims (2)
[1" claim-type="Currently amended] An adhesive applying method for applying an adhesive to the surface of any adhesive object through a coating syringe having a fine nozzle;
Adhesive constant temperature management method that keeps the internal temperature and the external temperature of the application syringe constant within the same range.
[2" claim-type="Currently amended] The method of claim 1, wherein the range is
Adhesive constant temperature management method is 26 ℃ to 28 ℃.

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同族专利:

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
1997-10-21|Application filed by 윤종용, 삼성전자 주식회사

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1997-10-21|Priority to KR1019970053886A

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1999-05-15|Publication of KR19990032752A

优先权:

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申请号 | 申请日 | 专利标题

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KR1019970053886A|KR19990032752A|1997-10-21|1997-10-21|Adhesive constant temperature control method|